Shenzhen S-leadjump Electronic Co., Ltd. -

Shenzhen S-leadjump Electronic Co., Ltd.

Showing 1 - 10 of 10, total 1 pages [First] [Previous] [Next] [Last]

key board
Specification: key board
Detail: layer:2 material:FR4 thickness:0.45mm surface treat:immersion gold packing:vacuum packing

6l hlf+gold finger pcb
Specification: 6L HLF+gold finger PCB
Detail: layer:6 material:FR4 thickness:1.6mm surface treat:HAL-leadfree+gold finger packing:vacuum packing

18l ic test pcb
Specification: 18L IC test PCB
Detail: layer:18 material:RO4003&RO4350 thickness:3.2mm surface treat:immersion gold packing:vacuum packing

lcd bonding pcb
Specification: LCD bonding PCB
Detail: layer:4 material:FR4 thickness:1.2mm surface treat:flash gold LCD Bonding packing:vacuum packing

8l hdi pcb
Specification: 8L HDI PCB
Detail: layer:8 material:FR4+RCC thickness:0.8mm surface treat:immersion gold + OSP blind and bury hole(1+4+1)packing:vacuum packing

double side gold board
Specification: 2L gold board
Detail: layer:2 material:FR4 thickness:1.0mm surface treat:flash gold packing:vacuum packing

6l immersion gold + gold finger pcb
Specification: 6L immersion gold + gold finger
Detail: layer:6 material:FR4 thickness:1.6mm surface treat:immersion gold + gold finger solder mask:yellow packing:vacuum packing

double side red ink pcb
Specification: 2L,FR4,flash gold
Detail: layer:2 material:FR4 thickness:1.2mm surface treat:flash gold packing:vacuum packing

blue ink gold finger board
Specification: blue ink gold finger board
Detail: layer:14 material:FR4 thickness:1.6mm copper:35oz surface treat:HLF+gold finger packing:vacuum packing

14layers ic test board
Specification: 14layer IC test board
Detail: layer:14 material:FR4 thickness:3.2mm surface treat:hard gold plating hard gold thickness:10-30U" packing:vacuum packing


Showing 1 - 10 of 10, total 1 pages [First] [Previous] [Next] [Last]
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